Low-temperature densification and microstructure of W–Cu composites with Sn additives
Dense and homogeneous W–Cu composites with high strength were successfully prepared from Cu-coated W powders by hot pressure sintering (800 °C) with Sn as activated additives. The relative density, microstructure and properties of W–Cu composites with Sn additives were studied. The results have indi...
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| Format: | Article |
| Language: | English |
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Elsevier
2021-01-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785420320901 |
| _version_ | 1818920188110700544 |
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| author | Yuan Li Jian Zhang Guoqiang Luo Yi Sun Qiang Shen Lianmeng Zhang |
| author_facet | Yuan Li Jian Zhang Guoqiang Luo Yi Sun Qiang Shen Lianmeng Zhang |
| author_sort | Yuan Li |
| collection | DOAJ |
| description | Dense and homogeneous W–Cu composites with high strength were successfully prepared from Cu-coated W powders by hot pressure sintering (800 °C) with Sn as activated additives. The relative density, microstructure and properties of W–Cu composites with Sn additives were studied. The results have indicated that the addition of Sn additives could significantly promote the densification of W–Cu composites. When Sn was added as additives, the sintering process is mainly the sintering between Cu–Cu and Cu–Sn, and the better mobility of Cu–Sn solid solution is help to eliminate pores and promote low-temperature densification. The relative density of sintered composites has reached 99.2% with 2 wt.% Sn additives. Stacking faults and Twin structure can be distinctly observed in the Cu matrix when 2 wt.% Sn was added as additives. With adding of Sn additives，the Vickers hardness has increased to 263.5 HV. The addition of Sn can lead to the strengthening of interface bonding of sintered composites, and the fracture microstructure with the ductile fracture of Cu matrix and the trans-granular fracture of W phase has been observed in the sintered composites with Sn additives. The bending strength of sintered composites has increased to 993.1 MPa due to the transform of fracture mechanism of sintered composites. The coefficient of thermal expansion of sintered composites has reduced to the minimum value of 7.56 × 10−6/K with the 1.5 wt.% Sn additives. |
| first_indexed | 2024-12-20T01:17:46Z |
| format | Article |
| id | doaj.art-2d3b447cddc545aab34027dd7817e1f9 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-12-20T01:17:46Z |
| publishDate | 2021-01-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-2d3b447cddc545aab34027dd7817e1f92022-12-21T19:58:32ZengElsevierJournal of Materials Research and Technology2238-78542021-01-0110121131Low-temperature densification and microstructure of W–Cu composites with Sn additivesYuan Li0Jian Zhang1Guoqiang Luo2Yi Sun3Qiang Shen4Lianmeng Zhang5State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, PR ChinaState Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, PR ChinaCorresponding author.; State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, PR ChinaState Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, PR ChinaCorresponding author.; State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, PR ChinaState Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, PR ChinaDense and homogeneous W–Cu composites with high strength were successfully prepared from Cu-coated W powders by hot pressure sintering (800 °C) with Sn as activated additives. The relative density, microstructure and properties of W–Cu composites with Sn additives were studied. The results have indicated that the addition of Sn additives could significantly promote the densification of W–Cu composites. When Sn was added as additives, the sintering process is mainly the sintering between Cu–Cu and Cu–Sn, and the better mobility of Cu–Sn solid solution is help to eliminate pores and promote low-temperature densification. The relative density of sintered composites has reached 99.2% with 2 wt.% Sn additives. Stacking faults and Twin structure can be distinctly observed in the Cu matrix when 2 wt.% Sn was added as additives. With adding of Sn additives，the Vickers hardness has increased to 263.5 HV. The addition of Sn can lead to the strengthening of interface bonding of sintered composites, and the fracture microstructure with the ductile fracture of Cu matrix and the trans-granular fracture of W phase has been observed in the sintered composites with Sn additives. The bending strength of sintered composites has increased to 993.1 MPa due to the transform of fracture mechanism of sintered composites. The coefficient of thermal expansion of sintered composites has reduced to the minimum value of 7.56 × 10−6/K with the 1.5 wt.% Sn additives.http://www.sciencedirect.com/science/article/pii/S2238785420320901W–Cu compositesSn additivesLow-temperature densificationMicrostructureProperties enhancement |
| spellingShingle | Yuan Li Jian Zhang Guoqiang Luo Yi Sun Qiang Shen Lianmeng Zhang Low-temperature densification and microstructure of W–Cu composites with Sn additives Journal of Materials Research and Technology W–Cu composites Sn additives Low-temperature densification Microstructure Properties enhancement |
| title | Low-temperature densification and microstructure of W–Cu composites with Sn additives |
| title_full | Low-temperature densification and microstructure of W–Cu composites with Sn additives |
| title_fullStr | Low-temperature densification and microstructure of W–Cu composites with Sn additives |
| title_full_unstemmed | Low-temperature densification and microstructure of W–Cu composites with Sn additives |
| title_short | Low-temperature densification and microstructure of W–Cu composites with Sn additives |
| title_sort | low temperature densification and microstructure of w cu composites with sn additives |
| topic | W–Cu composites Sn additives Low-temperature densification Microstructure Properties enhancement |
| url | http://www.sciencedirect.com/science/article/pii/S2238785420320901 |
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