Thermodynamic Assessment of Molten Bi<sub>x</sub>-Sn<sub>1−x</sub> (x = 0.1 to 0.9) Alloys and Microstructural Characterization of Some Bi-Sn Solder Alloys

Thermodynamic Assessment of Molten Bi<sub>x</sub>-Sn<sub>1−x</sub> (x = 0.1 to 0.9) Alloys and Microstructural Characterization of Some Bi-Sn Solder Alloys

Properties such as lower melting temperature, good tensile strength, good reliability, and well creep resistance, together with low production cost, make the system Bi-Sn an ideal candidate for fine soldering in applications such as reballing or reflow. The first objective of the work was to determi...

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Bibliographic Details
Main Authors: Florentina Niculescu, Ion Pencea, Gheorghe Iacob, Mihai Ghiţă, Mariana-Mirela Stănescu, Mircea-Ionuţ Petrescu, Emanuel-Laurenţiu Niculescu, Mihai Buţu, Constantin-Domenic Stăncel, Nicolae Şerban, Roxana-Marina Şolea, Andrei-Alexandru Ilie
Format: Article
Language:English
Published: MDPI AG 2024-03-01
Series:Materials
Subjects:
Bi-Sn
solder alloys
entropy
enthalpy
free energy
optical microscopy
Online Access:https://www.mdpi.com/1996-1944/17/7/1579

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https://www.mdpi.com/1996-1944/17/7/1579

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