Analysis of thermal density and heat sink on dissipative nanofluid along magnetized sheet and applications in microelectronic cooling systems
The objective of present analysis is to control excessive thermal behavior in microelectronic devices using heat sink and magnetic field. Improving technological innovation demands proper temperature evacuation in microelectronic components. A feasible method for cooling microelectronics is to use n...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24002168 |