Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes

Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes

For curing of fiber-reinforced epoxy composites, an alternative to thermal heating is the use of microwave energy, which cures quickly and consumes less energy. Employing thermal curing (TC) and microwave (MC) curing methods, we present a comparative study on the functional characteristics of fiber-...

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Bibliographic Details
Main Authors: Imran Haider, Iftikhar Hussain Gul, Malik Adeel Umer, Mutawara Mahmood Baig
Format: Article
Language:English
Published: MDPI AG 2023-02-01
Series:Materials
Subjects:
reinforced composites
microwave curing
dielectric properties
thermal properties
Online Access:https://www.mdpi.com/1996-1944/16/5/1790

Internet

https://www.mdpi.com/1996-1944/16/5/1790

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