Delamination of polyimide in hydrofluoric acid
Wet etching is a critical fabrication step for the mass production of micro and nanoelectronic devices. However, when an extremely corrosive acid such as hydrofluoric (HF) acid are used during etching, an undesirable damage might occur if the device includes a material that is not compatible with th...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
CTU Central Library
2021-12-01
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| Series: | Acta Polytechnica |
| Subjects: | |
| Online Access: | https://ojs.cvut.cz/ojs/index.php/ap/article/view/6855 |