Delamination of polyimide in hydrofluoric acid
Wet etching is a critical fabrication step for the mass production of micro and nanoelectronic devices. However, when an extremely corrosive acid such as hydrofluoric (HF) acid are used during etching, an undesirable damage might occur if the device includes a material that is not compatible with th...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
CTU Central Library
2021-12-01
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| Series: | Acta Polytechnica |
| Subjects: | |
| Online Access: | https://ojs.cvut.cz/ojs/index.php/ap/article/view/6855 |
| _version_ | 1818332482511044608 |
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| author | Asaad K. Edaan Al-mashaal Rebecca Cheung |
| author_facet | Asaad K. Edaan Al-mashaal Rebecca Cheung |
| author_sort | Asaad K. Edaan Al-mashaal |
| collection | DOAJ |
| description | Wet etching is a critical fabrication step for the mass production of micro and nanoelectronic devices. However, when an extremely corrosive acid such as hydrofluoric (HF) acid are used during etching, an undesirable damage might occur if the device includes a material that is not compatible with the acid. Polyimide thin films can serve as sacrificial/structural layers to fabricate freestanding or flexible devices. The importance of polyimide in microelectronics is due to its relatively low stress and compatibility with standard micromachining processes. In this work, a fast delamination process of a 4-μm-thin film of polyimide from a silicon substrate has been demonstrated. The films’ detachment has been performed using a wet-based etchant of HF acid. Specifically, the effect of HF concentration on the delamination time required to detach the polyimide film from the substrate has been investigated. This study is intended to provide the information on the compatibility of using polyimide films with HF, which can help in the design and fabrication of polyimide-based devices. |
| first_indexed | 2024-12-13T13:36:27Z |
| format | Article |
| id | doaj.art-2ea3d3839b4b485691687d6920880923 |
| institution | Directory Open Access Journal |
| issn | 1210-2709 1805-2363 |
| language | English |
| last_indexed | 2024-12-13T13:36:27Z |
| publishDate | 2021-12-01 |
| publisher | CTU Central Library |
| record_format | Article |
| series | Acta Polytechnica |
| spelling | doaj.art-2ea3d3839b4b485691687d69208809232022-12-21T23:43:47ZengCTU Central LibraryActa Polytechnica1210-27091805-23632021-12-0161668468810.14311/AP.2021.61.06843761Delamination of polyimide in hydrofluoric acidAsaad K. Edaan Al-mashaal0Rebecca Cheung1University of Basrah, Polymer Research Centre, Material Science Department, Basrah, 61004, IraqThe University of Edinburgh, Scottish Microelectronics Centre, School of Engineering, Edinburgh EH9 3FF, UKWet etching is a critical fabrication step for the mass production of micro and nanoelectronic devices. However, when an extremely corrosive acid such as hydrofluoric (HF) acid are used during etching, an undesirable damage might occur if the device includes a material that is not compatible with the acid. Polyimide thin films can serve as sacrificial/structural layers to fabricate freestanding or flexible devices. The importance of polyimide in microelectronics is due to its relatively low stress and compatibility with standard micromachining processes. In this work, a fast delamination process of a 4-μm-thin film of polyimide from a silicon substrate has been demonstrated. The films’ detachment has been performed using a wet-based etchant of HF acid. Specifically, the effect of HF concentration on the delamination time required to detach the polyimide film from the substrate has been investigated. This study is intended to provide the information on the compatibility of using polyimide films with HF, which can help in the design and fabrication of polyimide-based devices.https://ojs.cvut.cz/ojs/index.php/ap/article/view/6855polyimidedelaminationwet etchinghydrofluoric acid |
| spellingShingle | Asaad K. Edaan Al-mashaal Rebecca Cheung Delamination of polyimide in hydrofluoric acid Acta Polytechnica polyimide delamination wet etching hydrofluoric acid |
| title | Delamination of polyimide in hydrofluoric acid |
| title_full | Delamination of polyimide in hydrofluoric acid |
| title_fullStr | Delamination of polyimide in hydrofluoric acid |
| title_full_unstemmed | Delamination of polyimide in hydrofluoric acid |
| title_short | Delamination of polyimide in hydrofluoric acid |
| title_sort | delamination of polyimide in hydrofluoric acid |
| topic | polyimide delamination wet etching hydrofluoric acid |
| url | https://ojs.cvut.cz/ojs/index.php/ap/article/view/6855 |
| work_keys_str_mv | AT asaadkedaanalmashaal delaminationofpolyimideinhydrofluoricacid AT rebeccacheung delaminationofpolyimideinhydrofluoricacid |