Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing
Diamond wire sawing is the main machining technology for slicing various brittle materials, such as crystalline silicon, SiC, and NdFeB. Due to their high hardness and high brittleness, as well as the ease with which the surfaces of machined materials are damaged, it is difficult to further improve...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/11/2026 |