Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing
Diamond wire sawing is the main machining technology for slicing various brittle materials, such as crystalline silicon, SiC, and NdFeB. Due to their high hardness and high brittleness, as well as the ease with which the surfaces of machined materials are damaged, it is difficult to further improve...
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-11-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/11/2026 |
| _version_ | 1797464476207808512 |
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| author | Chenpu Zhang Zhikui Dong Yanheng Zhao Ziliang Liu Shang Wu Jiahao Yang |
| author_facet | Chenpu Zhang Zhikui Dong Yanheng Zhao Ziliang Liu Shang Wu Jiahao Yang |
| author_sort | Chenpu Zhang |
| collection | DOAJ |
| description | Diamond wire sawing is the main machining technology for slicing various brittle materials, such as crystalline silicon, SiC, and NdFeB. Due to their high hardness and high brittleness, as well as the ease with which the surfaces of machined materials are damaged, it is difficult to further improve the sawing efficiency and the surface quality based on research conducted on the original machining method. In this paper, a vibration-assisted diamond wire sawing method is proposed. We analyzed the impact of load on the ingot, motion trajectory, and sawing depth of the abrasive particles, and a macroscopic sawing force prediction model for the vibration-assisted sawing method was established and verified via experiments. Based on the single-wire-sawing experiment and prediction model, the influences of the vibration parameters and sawing parameters on the sawing force were determined. The influences of vibration assistance on the surface quality, including the roughness profile, waviness profile, thickness profile, Ra, and Rz, were explored through single-wire-sawing experiments, and the influences of vibration assistance on the geometric parameters of slices, such as the total thickness variation (TTV) and warp, were explored through multi-wire-sawing experiments. It was found that vibration-assisted sawing can reduce sawing force and improve surface quality. |
| first_indexed | 2024-03-09T18:08:41Z |
| format | Article |
| id | doaj.art-2f22b65608a849e9832552715db04e9d |
| institution | Directory Open Access Journal |
| issn | 2072-666X |
| language | English |
| last_indexed | 2024-03-09T18:08:41Z |
| publishDate | 2022-11-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj.art-2f22b65608a849e9832552715db04e9d2023-11-24T09:16:41ZengMDPI AGMicromachines2072-666X2022-11-011311202610.3390/mi13112026Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire SawingChenpu Zhang0Zhikui Dong1Yanheng Zhao2Ziliang Liu3Shang Wu4Jiahao Yang5School of Mechanical Engineering, Yanshan University, No. 438 West Hebei Avenue, Qinhuangdao 066004, ChinaSchool of Mechanical Engineering, Yanshan University, No. 438 West Hebei Avenue, Qinhuangdao 066004, ChinaSchool of Mechanical Engineering, Yanshan University, No. 438 West Hebei Avenue, Qinhuangdao 066004, ChinaSchool of Mechanical Engineering, Yanshan University, No. 438 West Hebei Avenue, Qinhuangdao 066004, ChinaSchool of Mechanical Engineering, Yanshan University, No. 438 West Hebei Avenue, Qinhuangdao 066004, ChinaSchool of Mechanical Engineering, Yanshan University, No. 438 West Hebei Avenue, Qinhuangdao 066004, ChinaDiamond wire sawing is the main machining technology for slicing various brittle materials, such as crystalline silicon, SiC, and NdFeB. Due to their high hardness and high brittleness, as well as the ease with which the surfaces of machined materials are damaged, it is difficult to further improve the sawing efficiency and the surface quality based on research conducted on the original machining method. In this paper, a vibration-assisted diamond wire sawing method is proposed. We analyzed the impact of load on the ingot, motion trajectory, and sawing depth of the abrasive particles, and a macroscopic sawing force prediction model for the vibration-assisted sawing method was established and verified via experiments. Based on the single-wire-sawing experiment and prediction model, the influences of the vibration parameters and sawing parameters on the sawing force were determined. The influences of vibration assistance on the surface quality, including the roughness profile, waviness profile, thickness profile, Ra, and Rz, were explored through single-wire-sawing experiments, and the influences of vibration assistance on the geometric parameters of slices, such as the total thickness variation (TTV) and warp, were explored through multi-wire-sawing experiments. It was found that vibration-assisted sawing can reduce sawing force and improve surface quality.https://www.mdpi.com/2072-666X/13/11/2026diamond wire sawingbrittle materialsvibration assistancesawing forcesurface qualitymulti-wire sawing |
| spellingShingle | Chenpu Zhang Zhikui Dong Yanheng Zhao Ziliang Liu Shang Wu Jiahao Yang Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing Micromachines diamond wire sawing brittle materials vibration assistance sawing force surface quality multi-wire sawing |
| title | Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing |
| title_full | Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing |
| title_fullStr | Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing |
| title_full_unstemmed | Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing |
| title_short | Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing |
| title_sort | sawing force prediction model and experimental study on vibration assisted diamond wire sawing |
| topic | diamond wire sawing brittle materials vibration assistance sawing force surface quality multi-wire sawing |
| url | https://www.mdpi.com/2072-666X/13/11/2026 |
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