Development of high impact toughness Cu/ODS-Cu joints using HIP bonding process for the preparation of W/Cu/ODS-Cu monoblock divertor

Development of high impact toughness Cu/ODS-Cu joints using HIP bonding process for the preparation of W/Cu/ODS-Cu monoblock divertor

Compared to CuCrZr, oxide dispersion strengthened copper alloy (ODS-Cu) exhibits higher stability of properties under irradiation and exposure to elevated temperatures, demonstrating broad application prospects in divertor components. Oxygen-free high thermal conductivity copper (Cu-OFHC) has been f...

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Bibliographic Details
Main Authors: Wu-Qingliang Peng, Yu-Ping Xu, Yu Tian, Huai-Zhi Li, Fang-Yong Du, Shou-An Puyang, Qiang Li, Hai-Shan Zhou, Guang-Nan Luo
Format: Article
Language:English
Published: Elsevier 2024-09-01
Series:Nuclear Materials and Energy
Subjects:
ODS-Cu
Divertor
HIP
Diffusion bonding
Online Access:http://www.sciencedirect.com/science/article/pii/S2352179124001431

Internet

http://www.sciencedirect.com/science/article/pii/S2352179124001431

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