The Stability and Electronic Structure of Cu(200)/AuCu(200) Interface: An Insight from First-Principle Calculation

The Stability and Electronic Structure of Cu(200)/AuCu(200) Interface: An Insight from First-Principle Calculation

AuCu phase had a significant effect on the bonding strength of Au80Sn20 alloy and Cu substrate. The formation of the AuCu(200)/Cu(200) interface significantly improves the shear strength of solder joints. Therefore, it is particularly important to analyze the strengthening mechanism of the AuCu phas...

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Bibliographic Details
Main Authors: Zihao Li, Junli Feng, Zhangxi Wu, Mingjun Pang, Dong Liu, Wenchao Yang, Yongzhong Zhan
Format: Article
Language:English
Published: MDPI AG 2022-02-01
Series:Materials
Subjects:
first principle
Cu/AuCu interface
adhesion strength
interfacial energy
density of states
Online Access:https://www.mdpi.com/1996-1944/15/4/1506

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https://www.mdpi.com/1996-1944/15/4/1506

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