The Roadmap of 2D Materials and Devices Toward Chips

The Roadmap of 2D Materials and Devices Toward Chips

Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the c...

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Bibliographic Details
Main Authors: Anhan Liu, Xiaowei Zhang, Ziyu Liu, Yuning Li, Xueyang Peng, Xin Li, Yue Qin, Chen Hu, Yanqing Qiu, Han Jiang, Yang Wang, Yifan Li, Jun Tang, Jun Liu, Hao Guo, Tao Deng, Songang Peng, He Tian, Tian-Ling Ren
Format: Article
Language:English
Published: SpringerOpen 2024-02-01
Series:Nano-Micro Letters
Subjects:
Two-dimensional materials
Roadmap
Integrated circuits
Post-Moore era
Online Access:https://doi.org/10.1007/s40820-023-01273-5

Internet

https://doi.org/10.1007/s40820-023-01273-5

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