The Roadmap of 2D Materials and Devices Toward Chips
Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the c...
| Main Authors: | , , , , , , , , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2024-02-01
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| Series: | Nano-Micro Letters |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/s40820-023-01273-5 |
| _version_ | 1797273515885330432 |
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| author | Anhan Liu Xiaowei Zhang Ziyu Liu Yuning Li Xueyang Peng Xin Li Yue Qin Chen Hu Yanqing Qiu Han Jiang Yang Wang Yifan Li Jun Tang Jun Liu Hao Guo Tao Deng Songang Peng He Tian Tian-Ling Ren |
| author_facet | Anhan Liu Xiaowei Zhang Ziyu Liu Yuning Li Xueyang Peng Xin Li Yue Qin Chen Hu Yanqing Qiu Han Jiang Yang Wang Yifan Li Jun Tang Jun Liu Hao Guo Tao Deng Songang Peng He Tian Tian-Ling Ren |
| author_sort | Anhan Liu |
| collection | DOAJ |
| description | Highlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the current trends and challenges encountered in the development of 2D materials is summarized. An in-depth roadmap outlining the future development of 2D electronics is presented, and the most accessible and promising avenues for 2D electronics are suggested. |
| first_indexed | 2024-03-07T14:45:28Z |
| format | Article |
| id | doaj.art-310f190895b3498ea432b3ebb33253d3 |
| institution | Directory Open Access Journal |
| issn | 2311-6706 2150-5551 |
| language | English |
| last_indexed | 2024-03-07T14:45:28Z |
| publishDate | 2024-02-01 |
| publisher | SpringerOpen |
| record_format | Article |
| series | Nano-Micro Letters |
| spelling | doaj.art-310f190895b3498ea432b3ebb33253d32024-03-05T20:01:03ZengSpringerOpenNano-Micro Letters2311-67062150-55512024-02-0116119610.1007/s40820-023-01273-5The Roadmap of 2D Materials and Devices Toward ChipsAnhan Liu0Xiaowei Zhang1Ziyu Liu2Yuning Li3Xueyang Peng4Xin Li5Yue Qin6Chen Hu7Yanqing Qiu8Han Jiang9Yang Wang10Yifan Li11Jun Tang12Jun Liu13Hao Guo14Tao Deng15Songang Peng16He Tian17Tian-Ling Ren18School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua UniversitySchool of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua UniversitySchool of Microelectronics, Fudan UniversitySchool of Electronic and Information Engineering, Beijing Jiaotong UniversityHigh-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of SciencesState Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of ChinaState Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of ChinaHigh-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of SciencesHigh-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of SciencesSchool of Microelectronics, Fudan UniversitySchool of Microelectronics, Fudan UniversitySchool of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua UniversityState Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of ChinaState Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of ChinaState Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of ChinaSchool of Electronic and Information Engineering, Beijing Jiaotong UniversityHigh-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of SciencesSchool of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua UniversitySchool of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua UniversityHighlights This review introduces the potential of 2D electronics for post-Moore era and discusses their current progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence chips, and quantum chips in sequence. A comprehensive analysis of the current trends and challenges encountered in the development of 2D materials is summarized. An in-depth roadmap outlining the future development of 2D electronics is presented, and the most accessible and promising avenues for 2D electronics are suggested.https://doi.org/10.1007/s40820-023-01273-5Two-dimensional materialsRoadmapIntegrated circuitsPost-Moore era |
| spellingShingle | Anhan Liu Xiaowei Zhang Ziyu Liu Yuning Li Xueyang Peng Xin Li Yue Qin Chen Hu Yanqing Qiu Han Jiang Yang Wang Yifan Li Jun Tang Jun Liu Hao Guo Tao Deng Songang Peng He Tian Tian-Ling Ren The Roadmap of 2D Materials and Devices Toward Chips Nano-Micro Letters Two-dimensional materials Roadmap Integrated circuits Post-Moore era |
| title | The Roadmap of 2D Materials and Devices Toward Chips |
| title_full | The Roadmap of 2D Materials and Devices Toward Chips |
| title_fullStr | The Roadmap of 2D Materials and Devices Toward Chips |
| title_full_unstemmed | The Roadmap of 2D Materials and Devices Toward Chips |
| title_short | The Roadmap of 2D Materials and Devices Toward Chips |
| title_sort | roadmap of 2d materials and devices toward chips |
| topic | Two-dimensional materials Roadmap Integrated circuits Post-Moore era |
| url | https://doi.org/10.1007/s40820-023-01273-5 |
| work_keys_str_mv | AT anhanliu theroadmapof2dmaterialsanddevicestowardchips AT xiaoweizhang theroadmapof2dmaterialsanddevicestowardchips AT ziyuliu theroadmapof2dmaterialsanddevicestowardchips AT yuningli theroadmapof2dmaterialsanddevicestowardchips AT xueyangpeng theroadmapof2dmaterialsanddevicestowardchips AT xinli theroadmapof2dmaterialsanddevicestowardchips AT yueqin theroadmapof2dmaterialsanddevicestowardchips AT chenhu theroadmapof2dmaterialsanddevicestowardchips AT yanqingqiu theroadmapof2dmaterialsanddevicestowardchips AT hanjiang theroadmapof2dmaterialsanddevicestowardchips AT yangwang theroadmapof2dmaterialsanddevicestowardchips AT yifanli theroadmapof2dmaterialsanddevicestowardchips AT juntang theroadmapof2dmaterialsanddevicestowardchips AT junliu theroadmapof2dmaterialsanddevicestowardchips AT haoguo theroadmapof2dmaterialsanddevicestowardchips AT taodeng theroadmapof2dmaterialsanddevicestowardchips AT songangpeng theroadmapof2dmaterialsanddevicestowardchips AT hetian theroadmapof2dmaterialsanddevicestowardchips AT tianlingren theroadmapof2dmaterialsanddevicestowardchips AT anhanliu roadmapof2dmaterialsanddevicestowardchips AT xiaoweizhang roadmapof2dmaterialsanddevicestowardchips AT ziyuliu roadmapof2dmaterialsanddevicestowardchips AT yuningli roadmapof2dmaterialsanddevicestowardchips AT xueyangpeng roadmapof2dmaterialsanddevicestowardchips AT xinli roadmapof2dmaterialsanddevicestowardchips AT yueqin roadmapof2dmaterialsanddevicestowardchips AT chenhu roadmapof2dmaterialsanddevicestowardchips AT yanqingqiu roadmapof2dmaterialsanddevicestowardchips AT hanjiang roadmapof2dmaterialsanddevicestowardchips AT yangwang roadmapof2dmaterialsanddevicestowardchips AT yifanli roadmapof2dmaterialsanddevicestowardchips AT juntang roadmapof2dmaterialsanddevicestowardchips AT junliu roadmapof2dmaterialsanddevicestowardchips AT haoguo roadmapof2dmaterialsanddevicestowardchips AT taodeng roadmapof2dmaterialsanddevicestowardchips AT songangpeng roadmapof2dmaterialsanddevicestowardchips AT hetian roadmapof2dmaterialsanddevicestowardchips AT tianlingren roadmapof2dmaterialsanddevicestowardchips |