EMI shielding leadless package solution for automotive

As components get closer together and more devices are integrated into a package, electromagnetic interference (EMI) is one of the most common concerns to be addressed. EMI shielding is not a new topic and its technology has widely been applied to consumer/communication products. However, mainstream...

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Bibliographic Details
Main Authors: ByongJin Kim, HyeongIl Jeon, DaeYoung Park, GiJeong Kim, Nam-Hee Cho, JinYoung Khim
Format: Article
Language:English
Published: Elsevier 2022-06-01
Series:Journal of Advanced Joining Processes
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2666330922000085