Simulation study and parameter optimization of laser TSV using artificial neural networks
Through-Silicon Vias (TSV) play an important role in the field of semiconductor 3D packaging by providing interconnections during layer-by-layer stacking. Laser machining of TSVs is advantageous over expensive photolithography steps in the DRIE process. It is environmentally friendly, reduces produc...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423014473 |