Electrical discharge machining of semiconductor materials: A review

Semiconductor materials including Silicon (Si), Germanium (Ge), Gallium Arsenide (GaAs), and Silicon Carbide (SiC) are difficult to machine due to their high brittleness and low plasticity. Conventional machining methods such as dicing and blade cutting used to cause quality problems such as cracks,...

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Bibliographic Details
Main Authors: Xuyang Zhu, Guangxian Li, John Mo, Songlin Ding
Format: Article
Language:English
Published: Elsevier 2023-07-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423014503