Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure

Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure

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Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal design tools that enable accurate solutions to be ge...

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Bibliographic Details
Main Authors: George Bobin Saji, Ajmal M., Deepu S. R., Aswin M., Ribin D., Akhil J.
Format: Article
Language:English
Published: EDP Sciences 2018-01-01
Series:MATEC Web of Conferences
Subjects:
Heat transfer
OpenFOAM
Boussinesq
Aspect ratio
Online Access:https://doi.org/10.1051/matecconf/201714404010

Internet

https://doi.org/10.1051/matecconf/201714404010

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