Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade
For cutting a SiC substrate coated with a metal film stably, a novel ductile-mode dicing process was developed using a blade made of a single body of poly-crystalline diamond (PCD) with only 50 μm in thickness. It is difficult for a conventional diamond blade with metal binder to cut the SiC substra...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
The Japan Society of Mechanical Engineers
2019-10-01
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| Series: | Journal of Advanced Mechanical Design, Systems, and Manufacturing |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/jamdsm/13/4/13_2019jamdsm0073/_pdf/-char/en |