Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade
For cutting a SiC substrate coated with a metal film stably, a novel ductile-mode dicing process was developed using a blade made of a single body of poly-crystalline diamond (PCD) with only 50 μm in thickness. It is difficult for a conventional diamond blade with metal binder to cut the SiC substra...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
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The Japan Society of Mechanical Engineers
2019-10-01
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| Series: | Journal of Advanced Mechanical Design, Systems, and Manufacturing |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/jamdsm/13/4/13_2019jamdsm0073/_pdf/-char/en |
| _version_ | 1811292466632982528 |
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| author | Takashi FUJITA Yasuo IZUMI Junji WATANABE |
| author_facet | Takashi FUJITA Yasuo IZUMI Junji WATANABE |
| author_sort | Takashi FUJITA |
| collection | DOAJ |
| description | For cutting a SiC substrate coated with a metal film stably, a novel ductile-mode dicing process was developed using a blade made of a single body of poly-crystalline diamond (PCD) with only 50 μm in thickness. It is difficult for a conventional diamond blade with metal binder to cut the SiC substrate in a straight line accurately due to insufficient buckling strength. In addition, self-sharpening effect of the cutting edge is suppressed by adhesion of metal film to blade surface. In this study, a rake face and a flank face of the cutting edge were formed by irradiating pulsed laser light tangentially to the cutting edge. Under the high speed rotation condition of 30,000 rpm (500 s-1), the developed PCD blade acts on the workpiece with the continuous cutting edge in a stable posture due to the inertial force of the rotation, and the depth of cut per a cutting edge is about 5 nm. Under these conditions, the ultrafine cutting tip of the metal film also becomes on the order of nanometers. 4H-SiC substrate 350 μm in thickness with Au / Ni / Ti film was cut using the developed PCD blade. Under the half cut condition, there was no chipping or crack on the surface, and the bottom of the groove was finished in a mirror state. Under the full cut condition with a width of 50 μm, the SiC substrate and the metal film were cut at once, and any crack did not occur at the interface between SiC and the metal film. As the result, it was demonstrated that ductile mode machining was realized and the metal film did not adhere to the cutting edge. |
| first_indexed | 2024-04-13T04:46:48Z |
| format | Article |
| id | doaj.art-344d5f3a852845069668be131a8d753e |
| institution | Directory Open Access Journal |
| issn | 1881-3054 |
| language | English |
| last_indexed | 2024-04-13T04:46:48Z |
| publishDate | 2019-10-01 |
| publisher | The Japan Society of Mechanical Engineers |
| record_format | Article |
| series | Journal of Advanced Mechanical Design, Systems, and Manufacturing |
| spelling | doaj.art-344d5f3a852845069668be131a8d753e2022-12-22T03:01:50ZengThe Japan Society of Mechanical EngineersJournal of Advanced Mechanical Design, Systems, and Manufacturing1881-30542019-10-01134JAMDSM0073JAMDSM007310.1299/jamdsm.2019jamdsm0073jamdsmUltrafine ductile-mode dicing technology for SiC substrate with metal film using PCD bladeTakashi FUJITA0Yasuo IZUMI1Junji WATANABE2Tokyo Seimitsu Co., Ltd.Shin-Nihon Tech, Inc.Kumamoto UniversityFor cutting a SiC substrate coated with a metal film stably, a novel ductile-mode dicing process was developed using a blade made of a single body of poly-crystalline diamond (PCD) with only 50 μm in thickness. It is difficult for a conventional diamond blade with metal binder to cut the SiC substrate in a straight line accurately due to insufficient buckling strength. In addition, self-sharpening effect of the cutting edge is suppressed by adhesion of metal film to blade surface. In this study, a rake face and a flank face of the cutting edge were formed by irradiating pulsed laser light tangentially to the cutting edge. Under the high speed rotation condition of 30,000 rpm (500 s-1), the developed PCD blade acts on the workpiece with the continuous cutting edge in a stable posture due to the inertial force of the rotation, and the depth of cut per a cutting edge is about 5 nm. Under these conditions, the ultrafine cutting tip of the metal film also becomes on the order of nanometers. 4H-SiC substrate 350 μm in thickness with Au / Ni / Ti film was cut using the developed PCD blade. Under the half cut condition, there was no chipping or crack on the surface, and the bottom of the groove was finished in a mirror state. Under the full cut condition with a width of 50 μm, the SiC substrate and the metal film were cut at once, and any crack did not occur at the interface between SiC and the metal film. As the result, it was demonstrated that ductile mode machining was realized and the metal film did not adhere to the cutting edge.https://www.jstage.jst.go.jp/article/jamdsm/13/4/13_2019jamdsm0073/_pdf/-char/enpoly-crystalline diamonddicing bladecutting edges by laser beamsic substratemetal filmductile-mode machining |
| spellingShingle | Takashi FUJITA Yasuo IZUMI Junji WATANABE Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade Journal of Advanced Mechanical Design, Systems, and Manufacturing poly-crystalline diamond dicing blade cutting edges by laser beam sic substrate metal film ductile-mode machining |
| title | Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade |
| title_full | Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade |
| title_fullStr | Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade |
| title_full_unstemmed | Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade |
| title_short | Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade |
| title_sort | ultrafine ductile mode dicing technology for sic substrate with metal film using pcd blade |
| topic | poly-crystalline diamond dicing blade cutting edges by laser beam sic substrate metal film ductile-mode machining |
| url | https://www.jstage.jst.go.jp/article/jamdsm/13/4/13_2019jamdsm0073/_pdf/-char/en |
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