Silicone-based Chip-in-Foil System
Aiming at devices for bioelectronic medicine, this paper proposes a die embedding process for the fabrication of flexible smart implants. By combining thinned bare dies with a polymeric encapsulation, completely flexible implants can be designed. The dies are encapsulated using a flip-chip process a...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
De Gruyter
2018-09-01
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| Series: | Current Directions in Biomedical Engineering |
| Subjects: | |
| Online Access: | https://doi.org/10.1515/cdbme-2018-0033 |