Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing

Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing

The electromigration behavior of microbumps is inevitably altered under bidirectional currents. Herein, based on a designed test system, the effect of current direction and time proportion of forward current is investigated on Cu Pillar/Ni/Sn-1.8 Ag/Cu microbumps. Under thermo-electric stressing, mi...

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Bibliographic Details
Main Authors: Zhiwei Fu, Jian Chen, Pengfei Zhao, Xiaotong Guo, Qingzhong Xiao, Xing Fu, Jian Wang, Chao Yang, Jile Xu, Jia-Yue Yang
Format: Article
Language:English
Published: MDPI AG 2023-01-01
Series:Materials
Subjects:
bidirectional current
microbumps
electromigration
Cu-Sn compound
Online Access:https://www.mdpi.com/1996-1944/16/3/1134

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https://www.mdpi.com/1996-1944/16/3/1134

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