MEMS-Based Electrochemical Seismometer with a Sensing Unit Integrating Four Electrodes
This paper presents a new process to fabricate a sensing unit of electrochemical seismometers using only one silicon–glass–silicon bonded wafer. By integrating four electrodes on one silicon–glass–silicon bonded wafer, the consistency of the developed sensing unit was greatly improved, benefiting fr...
Main Authors: | , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-06-01
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Series: | Micromachines |
Subjects: | |
Online Access: | https://www.mdpi.com/2072-666X/12/6/699 |