Effect of Abrasive Grain Concession on Micromechanical Behavior of Lapping Sapphire by FAP

Aiming at exploring the material removal mechanism for sapphire using diamond abrasive grains at the microscopic level, this paper modeled and analyzed the microscopic yield behavior of diamond abrasive grains in the FAP grinding process of sapphire. Molecular dynamics were used to simulate the effe...

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Dettagli Bibliografici
Autori principali: Huimin Xu, Jianbin Wang, Yiliang Xu, Qingan Li, Benchi Jiang
Natura: Articolo
Lingua:English
Pubblicazione: MDPI AG 2022-08-01
Serie:Micromachines
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Accesso online:https://www.mdpi.com/2072-666X/13/8/1322