Effect of Abrasive Grain Concession on Micromechanical Behavior of Lapping Sapphire by FAP

Effect of Abrasive Grain Concession on Micromechanical Behavior of Lapping Sapphire by FAP

Aiming at exploring the material removal mechanism for sapphire using diamond abrasive grains at the microscopic level, this paper modeled and analyzed the microscopic yield behavior of diamond abrasive grains in the FAP grinding process of sapphire. Molecular dynamics were used to simulate the effe...

Full description

Bibliographic Details
Main Authors: Huimin Xu, Jianbin Wang, Yiliang Xu, Qingan Li, Benchi Jiang
Format: Article
Language:English
Published: MDPI AG 2022-08-01
Series:Micromachines
Subjects:
sapphire
molecular dynamics
lapping
cutting depth
removal mechanism
Online Access:https://www.mdpi.com/2072-666X/13/8/1322

Internet

https://www.mdpi.com/2072-666X/13/8/1322

Similar Items