Quasi in-situ study on the slip activation mechanism of high purity tantalum during compress deformation

The microstructure evolution is very complex during the processing of tantalum sputtering target for integrated circuits, and the deformation mechanisms for this evolution is still unclear. This work aims to investigate the deformation mechanism in a quasi-in-situ way, particularly the activation of...

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Bibliographic Details
Main Authors: Yahui Liu, Qianqian Zhu, Kexing Song, Yanjun Zhou, He Liu, Xiaokang Yang, Shifeng Liu, Lingfei Cao
Format: Article
Language:English
Published: Elsevier 2022-09-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785422013114