Mechanism of Grain Densification in Nano- and Poly-Crystalline Cu Films and Its Impact in Advanced Metallization Processes

Mechanism of Grain Densification in Nano- and Poly-Crystalline Cu Films and Its Impact in Advanced Metallization Processes

We investigate the microstructural evolution of electrochemically deposited poly-crystalline Cu films during subsequent thermal process cycles at mild maximum temperatures, compatible with the integration in advanced metallization schemes for electronic device manufacturing. The modifications induce...

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Bibliographic Details
Main Authors: Brunella Cafra, Alessandra Alberti, Gaetano Calogero, Ioannis Deretzis, Antonio Landi, Daniele Pagano, Salvatore Sanzaro, Antonino La Magna
Format: Article
Language:English
Published: MDPI AG 2024-01-01
Series:Crystals
Subjects:
copper
metallization
annealing
warpage
polycrystalline
grain boundaries
Online Access:https://www.mdpi.com/2073-4352/14/2/125

Internet

https://www.mdpi.com/2073-4352/14/2/125

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