Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Bibliographic Details
Main Authors:	Lanfeng Guo, Renlong Liu, Zhaobo He, Shaoping Li, Tong Tan, Changyuan Tao
Format:	Article
Language:	English
Published:	American Chemical Society 2024-03-01
Series:	ACS Omega
Online Access:	https://doi.org/10.1021/acsomega.3c09548

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