Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications
Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
American Chemical Society
2024-03-01
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Series: | ACS Omega |
Online Access: | https://doi.org/10.1021/acsomega.3c09548 |