Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To addres...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-03-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/11/6/849 |