Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the T...

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Bibliographic Details
Main Authors: William Anderson Lee Sanchez, Jia-Wun Li, Hsien-Tang Chiu, Chih-Chia Cheng, Kuo-Chan Chiou, Tzong-Ming Lee, Chih-Wei Chiu
Format: Article
Language:English
Published: MDPI AG 2022-07-01
Series:Polymers
Subjects:
electronic encapsulation packaging
underfill material
hybrid filler
aluminum nitride
boron nitride
viscosity
Online Access:https://www.mdpi.com/2073-4360/14/14/2950

Internet

https://www.mdpi.com/2073-4360/14/14/2950

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