Modeling and Performance Analysis of Shielded Differential Annular Through-Silicon Via (SD-ATSV) for 3-D ICs
A shielded-differential annular through-silicon via (SD-ATSV) is proposed and investigated. The equivalent circuit model is developed with the influence of the electrically floating silicon substrate taken into account. By virtue of the circuit model, the frequency- and time-domain electrical charac...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2018-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8383966/ |