Novel Peak-Source-Scanning (NPSS) Model for Thermal Control of Systems-in-Package (SiP)

Novel Peak-Source-Scanning (NPSS) Model for Thermal Control of Systems-in-Package (SiP)

One of the fast-growing electronic integration technologies in the modern high-density microelectronics industry is System-in-Package (SiP). It is expected to accelerate application development when reducing implementation risks with optimized codes. However, monitoring the thermal behavior of every...

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Bibliographic Details
Main Authors: Aziz Oukaira, Dhaou Said, Djallel Eddine Touati, Nader El-Zarif, Ahmad Hassan, Yvon Savaria, Ahmed Lakhssassi
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Access
Subjects:
Peak source-scanning
system-in-package
thermal control
thermal monitoring
thermal peak
finite element method
Online Access:https://ieeexplore.ieee.org/document/10699335/

Internet

https://ieeexplore.ieee.org/document/10699335/

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