Recent Studies on Thermally Conductive 3D Aerogels/Foams with the Segregated Nanofiller Framework
As technology advances toward ongoing circuit miniaturization and device size reduction followed by improved power density, heat dissipation is becoming a key challenge for electronic equipment. Heat accumulation can be prevented if the heat from electrical equipment is efficiently exported, ensurin...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-11-01
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| Series: | Polymers |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4360/14/22/4796 |