Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu<sub>6</sub>Sn<sub>5</sub> Growth during Multiple Reflows

Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu<sub>6</sub>Sn<sub>5</sub> Growth during Multiple Reflows

The multiple reflows process is widely used in 3D packaging in the field of electronic packaging. The growth behavior of interfacial intermetallic compound (IMC) is more important to the reliability of solder joints. In this paper, experimental measurement combined with simulation calculation were p...

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Bibliographic Details
Main Authors: Min Shang, Chong Dong, Haoran Ma, Yunpeng Wang, Haitao Ma
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Metals
Subjects:
multiple reflow
Cu concentration
Cu<sub>6</sub>Sn<sub>5</sub> growth
solder property
Online Access:https://www.mdpi.com/2075-4701/11/12/2041

Internet

https://www.mdpi.com/2075-4701/11/12/2041

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