Bond strength evaluation of heat treated Cu-Al wire bonding
Bond strength evaluation of wire bonding in microchips is the key study in any wire bonding mechanism. The quality of the wire bond interconnection relates very closely to the reliability of the microchip during performance of its function in any application. In many reports, concerns regarding the...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Universiti Malaysia Pahang Publishing
2018-12-01
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| Series: | Journal of Mechanical Engineering and Sciences |
| Subjects: | |
| Online Access: | https://journal.ump.edu.my/jmes/article/view/382 |