Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
American Chemical Society
2021-12-01
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| Series: | ACS Omega |
| Online Access: | https://doi.org/10.1021/acsomega.1c05914 |