Wafer Surface Defect Detection Based on Background Subtraction and Faster R-CNN

Wafer Surface Defect Detection Based on Background Subtraction and Faster R-CNN

Concerning the problem that wafer surface defects are easily confused with the background and are difficult to detect, a new detection method for wafer surface defects based on background subtraction and Faster R-CNN is proposed. First, an improved spectral analysis method is proposed to measure the...

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Bibliographic Details
Main Authors: Jiebing Zheng, Tao Zhang
Format: Article
Language:English
Published: MDPI AG 2023-04-01
Series:Micromachines
Subjects:
defect detection
background subtraction
period measurement
image reconstruction
Faster R-CNN
Online Access:https://www.mdpi.com/2072-666X/14/5/905

Internet

https://www.mdpi.com/2072-666X/14/5/905

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