Wafer Surface Defect Detection Based on Background Subtraction and Faster R-CNN

Wafer Surface Defect Detection Based on Background Subtraction and Faster R-CNN

Concerning the problem that wafer surface defects are easily confused with the background and are difficult to detect, a new detection method for wafer surface defects based on background subtraction and Faster R-CNN is proposed. First, an improved spectral analysis method is proposed to measure the...

Celý popis

Podrobná bibliografie
Hlavní autoři: Jiebing Zheng, Tao Zhang
Médium: Článek
Jazyk:English
Vydáno: MDPI AG 2023-04-01
Edice:Micromachines
Témata:
defect detection
background subtraction
period measurement
image reconstruction
Faster R-CNN
On-line přístup:https://www.mdpi.com/2072-666X/14/5/905

Internet

https://www.mdpi.com/2072-666X/14/5/905

Podobné jednotky