Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles

Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles

The rapid development of space exploration technology was intensifying the desire for lead-free solders with high performance and reliability under extreme temperature environments. In this study, the influence of TiO2 nanoparticle addition on the microstructure, growth behavior of interfacial inter...

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Bibliographic Details
Main Authors: Ruyu Tian, Yan Gao, Jiayue Wen, Pengrong Lin, Shimeng Xu, Yanhong Tian
Format: Article
Language:English
Published: Elsevier 2024-03-01
Series:Journal of Materials Research and Technology
Subjects:
Composite solder
Intermetallic compound
Shear property
Thermal shock
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424005349

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http://www.sciencedirect.com/science/article/pii/S2238785424005349

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