A DFT Characterization of Structural, Mechanical, and Thermodynamic Properties of Ag<sub>9</sub>In<sub>4</sub> Binary Intermetallic Compound

A DFT Characterization of Structural, Mechanical, and Thermodynamic Properties of Ag<sub>9</sub>In<sub>4</sub> Binary Intermetallic Compound

The intermetallic compounds (IMCs) at the interface between the solder joint and metal bond pad/under bump metallization (UBM) exert a significant impact on the thermal–mechanical behavior of microelectronic packages because of their unique physical properties. In this study, a theoretical investiga...

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Bibliographic Details
Main Authors: Hsien-Chie Cheng, Ching-Feng Yu
Format: Article
Language:English
Published: MDPI AG 2022-10-01
Series:Metals
Subjects:
intermetallic compound
ab initio calculations
density functional theory
structure-property
mechanical properties
thermodynamic properties
Online Access:https://www.mdpi.com/2075-4701/12/11/1852

Internet

https://www.mdpi.com/2075-4701/12/11/1852

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