Performance of Particleboard Made of Agroforestry Residues Bonded with Thermosetting Adhesive Derived from Waste Styrofoam
This paper investigated the upcycling process of thermoplastic waste polystyrene (WPS) into thermosetting particleboard adhesive using two cross-linkers, namely methylene diphenyl diisocyanate (MDI) and maleic anhydride (MA). The WPS was dissolved in an organic co-solvent. The weight ratio of WPS/co...
Main Authors: | , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2024-02-01
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Series: | Polymers |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4360/16/4/543 |