Research on dynamic mechanical behavior and damage evolution mechanism of Cu/WCp laminated composites

Research on dynamic mechanical behavior and damage evolution mechanism of Cu/WCp laminated composites

In this paper, the effect of WCp particle content (3 and 15 vol.%) and laminate orientation on the mechanical behavior of laminated Cu/WCp/15p and Cu/WCp/3p composites under dynamic impact was investigated using the split Hopkinson pressure bar (SHPB) test. Subsequently, the micro-damage evolution m...

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Bibliographic Details
Main Authors: Zhang Yubo, Guo Rongxin, Xia Haiting, Yan Feng, Liu Xing Yao
Format: Article
Language:English
Published: IOP Publishing 2021-01-01
Series:Materials Research Express
Subjects:
Cu/WCp laminated composites
lamination direction
high strain rate
constitutive relation
damage evolution mechanism
Online Access:https://doi.org/10.1088/2053-1591/abda6a

Internet

https://doi.org/10.1088/2053-1591/abda6a

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