Effect of the anisotropic characteristics of β-Sn on current-induced solder evolution
The miniaturization trend of three-dimensional integrated circuits poses great challenges to solder reliability under high current stressing since anisotropic issues tend to be enhanced in microscale solder bumps. To address these challenges, the solder evolution at the microscale and the correspond...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-12-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127522009613 |