Particle packing theory guided multiscale alumina filled epoxy resin with excellent thermal and dielectric performances
Polymers and composites with high thermal conductivity are promising yet challenging for the growing demand of thermal management in electrical and electronic equipment. Guided by the closest packing model, a multiscale filling Al2O3 strategy was designed and incorporated with epoxy resin (EP) to fo...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-09-01
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| Series: | Journal of Materiomics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2352847822000272 |