Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials

Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials

In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations. X-ray diffraction (XRD) and LXRD micro-area residual st...

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Bibliographic Details
Main Authors: Ming Chen, Jiasheng Li, Wei Su, Zhenhua Nie, Butian Zhong, Xianshan Dong
Format: Article
Language:English
Published: MDPI AG 2023-10-01
Series:Crystals
Subjects:
residual stress
crystal structures
ceramic ball grid array (CBGA)
encapsulation
X-ray diffraction (XRD)
finite element analysis
Online Access:https://www.mdpi.com/2073-4352/13/10/1462

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https://www.mdpi.com/2073-4352/13/10/1462

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