Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials
In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations. X-ray diffraction (XRD) and LXRD micro-area residual st...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-10-01
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| Series: | Crystals |
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| Online Access: | https://www.mdpi.com/2073-4352/13/10/1462 |
| _version_ | 1797574195423477760 |
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| author | Ming Chen Jiasheng Li Wei Su Zhenhua Nie Butian Zhong Xianshan Dong |
| author_facet | Ming Chen Jiasheng Li Wei Su Zhenhua Nie Butian Zhong Xianshan Dong |
| author_sort | Ming Chen |
| collection | DOAJ |
| description | In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations. X-ray diffraction (XRD) and LXRD micro-area residual stress analyzer were employed to determine the residual strain and stress of the CBGA sample encapsulation cover and solder joints. Subsequently, the experimental data were utilized to verify the accuracy of the simulation. The discrepancy between experimental measurements and simulation outcomes of the residual stress following reflow soldering of CBGA-assembled micro-solder joints is below 14%. The analysis also included thermal warping deformation of the CBGA encapsulation cover and how the residual stress was influenced by the diameter, spacing, and height of the solder joints. The study reveals that the residual stress following reflow soldering of BGA solder joints is non-uniformly distributed within the array. Within a single solder joint, residual stress gradually increases in distribution from its middle to the point where it make contact with the PCB and chip, with the highest level of residual stress observed where the solder joint contacts the chip. The variation in material parameters, such as the coefficient of thermal expansion, is the primary cause of thermal warping deformation on the surface of CBGA encapsulation covers. Three primary factors significantly impact the residual stress on BGA solder joints: solder joint diameter, spacing, and height. The maximum value is inversely proportional to the height of the solder joints and the residual stress. Conversely, the diameter and spacing of the joints are positively proportional to the highest value. When the diameter of the solder joint is increased from 0.55 mm to 0.75 mm, the maximum residual stress in the BGA solder joint increases from 37.243 MPa to 36.835 MPa. Conversely, increasing the height of the solder joint from 0.36 mm to 0.44 mm reduces the stress from 39.776 MPa to 36.835 MPa. |
| first_indexed | 2024-03-10T21:19:27Z |
| format | Article |
| id | doaj.art-3de47b3671954a60b3c6df9ec20d401e |
| institution | Directory Open Access Journal |
| issn | 2073-4352 |
| language | English |
| last_indexed | 2024-03-10T21:19:27Z |
| publishDate | 2023-10-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Crystals |
| spelling | doaj.art-3de47b3671954a60b3c6df9ec20d401e2023-11-19T16:09:34ZengMDPI AGCrystals2073-43522023-10-011310146210.3390/cryst13101462Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device MaterialsMing Chen0Jiasheng Li1Wei Su2Zhenhua Nie3Butian Zhong4Xianshan Dong5School of Mechanics and Construction Engineering, Jinan University, Guangzhou 510632, ChinaCollege of Mechanical and Electrical Engineering, Binzhou Polytechnic, Binzhou 256603, ChinaScience and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, ChinaSchool of Mechanics and Construction Engineering, Jinan University, Guangzhou 510632, ChinaScience and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, ChinaScience and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou 510610, ChinaIn this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations. X-ray diffraction (XRD) and LXRD micro-area residual stress analyzer were employed to determine the residual strain and stress of the CBGA sample encapsulation cover and solder joints. Subsequently, the experimental data were utilized to verify the accuracy of the simulation. The discrepancy between experimental measurements and simulation outcomes of the residual stress following reflow soldering of CBGA-assembled micro-solder joints is below 14%. The analysis also included thermal warping deformation of the CBGA encapsulation cover and how the residual stress was influenced by the diameter, spacing, and height of the solder joints. The study reveals that the residual stress following reflow soldering of BGA solder joints is non-uniformly distributed within the array. Within a single solder joint, residual stress gradually increases in distribution from its middle to the point where it make contact with the PCB and chip, with the highest level of residual stress observed where the solder joint contacts the chip. The variation in material parameters, such as the coefficient of thermal expansion, is the primary cause of thermal warping deformation on the surface of CBGA encapsulation covers. Three primary factors significantly impact the residual stress on BGA solder joints: solder joint diameter, spacing, and height. The maximum value is inversely proportional to the height of the solder joints and the residual stress. Conversely, the diameter and spacing of the joints are positively proportional to the highest value. When the diameter of the solder joint is increased from 0.55 mm to 0.75 mm, the maximum residual stress in the BGA solder joint increases from 37.243 MPa to 36.835 MPa. Conversely, increasing the height of the solder joint from 0.36 mm to 0.44 mm reduces the stress from 39.776 MPa to 36.835 MPa.https://www.mdpi.com/2073-4352/13/10/1462residual stresscrystal structuresceramic ball grid array (CBGA)encapsulationX-ray diffraction (XRD)finite element analysis |
| spellingShingle | Ming Chen Jiasheng Li Wei Su Zhenhua Nie Butian Zhong Xianshan Dong Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials Crystals residual stress crystal structures ceramic ball grid array (CBGA) encapsulation X-ray diffraction (XRD) finite element analysis |
| title | Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials |
| title_full | Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials |
| title_fullStr | Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials |
| title_full_unstemmed | Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials |
| title_short | Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials |
| title_sort | residual stress testing and simulation analysis of crystal structures of electronic device materials |
| topic | residual stress crystal structures ceramic ball grid array (CBGA) encapsulation X-ray diffraction (XRD) finite element analysis |
| url | https://www.mdpi.com/2073-4352/13/10/1462 |
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