Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package

Shear performance and accelerated reliability of solder interconnects for fan-out wafer-level package

As the packaging density in wafer-level packaging increases, there is an increasing need for packaging processes for fan-out packaged devices; thus, the soldering reliability of board-level devices is particularly important. Fan-out wafer-level packaging (FOWLP) is typically packaged using flip-chip...

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Bibliographic Details
Main Authors: Shuye Zhang, Ran Duan, Sunwu Xu, Panfei Xue, Chengqian Wang, Jieshi Chen, Kyung-Wook Paik, Peng He
Format: Article
Language:English
Published: Elsevier 2022-06-01
Series:Journal of Advanced Joining Processes
Subjects:
Fan-out wafer-level package
Shear strength
Soldering process
Accelerated reliability
Online Access:http://www.sciencedirect.com/science/article/pii/S2666330921000364

Internet

http://www.sciencedirect.com/science/article/pii/S2666330921000364

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