A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration
A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that t...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2016-01-01
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| Series: | IEEE Journal of the Electron Devices Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7444113/ |