A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration
A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that t...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
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IEEE
2016-01-01
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| Series: | IEEE Journal of the Electron Devices Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7444113/ |
| _version_ | 1818417200736763904 |
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| author | Yu-Chen Hu Kuan-Neng Chen |
| author_facet | Yu-Chen Hu Kuan-Neng Chen |
| author_sort | Yu-Chen Hu |
| collection | DOAJ |
| description | A novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative bonding approach is considered a breakthrough of the traditional restrictions in flexible substrates, including I/O pitch, electrical reliability, and bonding conditions. This development is expected to contribute to the fabrication of future flexible substrate stacking. |
| first_indexed | 2024-12-14T12:03:00Z |
| format | Article |
| id | doaj.art-3f644f785205496391633f9719166491 |
| institution | Directory Open Access Journal |
| issn | 2168-6734 |
| language | English |
| last_indexed | 2024-12-14T12:03:00Z |
| publishDate | 2016-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Journal of the Electron Devices Society |
| spelling | doaj.art-3f644f785205496391633f97191664912022-12-21T23:01:56ZengIEEEIEEE Journal of the Electron Devices Society2168-67342016-01-014418518810.1109/JEDS.2016.25373597444113A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate IntegrationYu-Chen Hu0Kuan-Neng Chen1https://orcid.org/0000-0003-4316-0007Department of Electronics Engineering, National Chiao Tung University, Hsinchu, TaiwanDepartment of Electronics Engineering, National Chiao Tung University, Hsinchu, TaiwanA novel bonding approach for flexible substrate vertical stacking is proposed in this paper. Unlike the traditional anisotropic conductive/non-conductive paste/film used in flexible substrate bonding, the metal thin film is adopted as bonding material in this approach. Experiment results show that the novel bonding approach has good electrical properties and reliability performances. The innovative bonding approach is considered a breakthrough of the traditional restrictions in flexible substrates, including I/O pitch, electrical reliability, and bonding conditions. This development is expected to contribute to the fabrication of future flexible substrate stacking.https://ieeexplore.ieee.org/document/7444113/Flexible substrate3D integrationFine-pitch applicationBonding |
| spellingShingle | Yu-Chen Hu Kuan-Neng Chen A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration IEEE Journal of the Electron Devices Society Flexible substrate 3D integration Fine-pitch application Bonding |
| title | A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration |
| title_full | A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration |
| title_fullStr | A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration |
| title_full_unstemmed | A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration |
| title_short | A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration |
| title_sort | novel bonding approach and its electrical performance for flexible substrate integration |
| topic | Flexible substrate 3D integration Fine-pitch application Bonding |
| url | https://ieeexplore.ieee.org/document/7444113/ |
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