The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs) will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegratio...

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Bibliographic Details
Main Authors: Amlan Ganguly, M. Meraj Ahmed, Rounak Singh Narde, Abhishek Vashist, Md Shahriar Shamim, Naseef Mansoor, Tanmay Shinde, Suryanarayanan Subramaniam, Sagar Saxena, Jayanti Venkataraman, Mark Indovina
Format: Article
Language:English
Published: MDPI AG 2018-02-01
Series:Journal of Low Power Electronics and Applications
Subjects:
wireless interconnect
multi-chip system
heterogeneous system
in-package memory
IoT
Online Access:http://www.mdpi.com/2079-9268/8/1/5

Internet

http://www.mdpi.com/2079-9268/8/1/5

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