TEM observation of two-dimensional growth of lamellar gold electroplated on copper wires
Electroplating is an essential process to produce Cu–Au complex bonding wires. Therefore, mastering the general growth behaviour of gold film plated on copper substrate has an instructive effect on the subsequent processes of pinching-out and annealing in the processing of Cu–Au complex bonding wire...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2020-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/ab80b8 |