Investigation on the flow limitation during copper electroplating of polyurethane foam
The electroplating method was employed to precipitate ionic Cu on the polymeric foam substrate. To compare the effective parameters in the foam electroplating process, open-cell polyurethane foams with different pore sizes 30, 35, 40, and 70 ppi (pore per inch) were used. To attain the desired condu...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S223878542100733X |