Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits

Virtualization-Based Efficient TSV Repair for 3-D Integrated Circuits

Three-dimensional (3-D) integration offers a promising solution to the technology scaling barriers. Reliability of the 3-D Integrated Circuits (ICs) is highly dependent on the integrity of the underlying interconnect. Through Silicon Via (TSV) based 3-D ICs would suffer from low yield due to the fau...

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Bibliographic Details
Main Authors: Muhammad Imran, Hyunseung Han, Jooho Kim, Taehyun Kwon, Jaeyong Chung, Joon-Sung Yang
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
3-D integrated circuit
eye diagram simulations
multiple bits transmission
through silicon via (TSV)
TSV Virtualization
TSV repair
Online Access:https://ieeexplore.ieee.org/document/8832259/

Internet

https://ieeexplore.ieee.org/document/8832259/

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